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INTEGRATED CIRCUITS
DATA SHEET
UBA2024 Half-bridge power IC for CFL lamps
Product specification Supersedes data of 2003 Aug 13 2004 Feb 03
Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
FEATURES * Integrated half-bridge power transistors * Integrated bootstrap diode * Integrated low-voltage supply * Maximum voltage of 550 V * Adjustable oscillator frequency * Soft start * Minimum glow time control. APPLICATIONS * Driver for any kind of load in a half-bridge configuration * Especially for electronically self-ballasted Compact Fluorescent Lamps (CFL) for lamp currents up to 220 mA (RMS) under the restriction that the maximum junction temperature is not exceeded. ORDERING INFORMATION TYPE NUMBER UBA2024P BLOCK DIAGRAM PACKAGE NAME DIP8 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) GENERAL DESCRIPTION
UBA2024
The UBA2024 is a high-voltage monolithic integrated circuit made in the EZ-HV SOI process. The IC is designed for driving CFL lamps in a half-bridge configuration. The IC features a soft start function, an adjustable internal oscillator and an internal drive function with a high-voltage level shifter for driving the half-bridge. To guarantee an accurate 50% duty cycle, the oscillator signal is passed through a divider before being fed to the output drivers.
VERSION SOT97-1
6
UBA2024
VDD CONTROL VDD SW 7 HS 1 SWEEP AND GLOW TIME CONTROL VDD(stop) HIGH VOLTAGE LEVEL SHIFTER HIGH SIDE DRIVER 5 RC 8 OSCILLATOR DIVIDE-BY-2 DEAD TIME LOW SIDE DRIVER SGND 2 4
mdb029
HV
3
FS
OUT
LS
PGND
Fig.1 Block diagram.
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
PINNING SYMBOL SW SGND FS PGND OUT HV VDD RC PIN 1 2 3 4 5 6 7 8 DESCRIPTION sweep timing input signal ground high-side floating supply output power ground half-bridge output high-voltage supply internal low-voltage supply output internal oscillator input Reset
FS PGND 3 4
MCE409
UBA2024
handbook, halfpage
SW 1 SGND 2
8 RC 7 VDD HV OUT
UBA2024P
6 5
Fig.2 Pin configuration DIP8 package.
FUNCTIONAL DESCRIPTION Supply voltage The UBA2024 is powered by a supply voltage applied to pin HV. The IC generates its own low supply voltage for the internal circuitry and therefore, an additional external low-voltage supply is not required. Start-up state With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the start-up state the high-side power transistor is not conducting and the low-side power transistor is switched on. The internal circuit is reset and the capacitors on the bootstrap pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to ground. The start-up state is defined until VDD = VDD(start). Sweep mode The IC enters the sweep mode at the moment the voltage on pin VDD > VDD(start). The capacitor on pin SW is charged by Isweep and the half-bridge circuit starts oscillating. The circuit enters the start-up state again when the voltage on pin VDD < VDD(stop).
A DC reset circuit is incorporated in the high-side driver. The high-side transistor is switched off when the voltage on pin FS is below the high-side lockout voltage VFS(lock). Oscillation The oscillation is based upon the 555-timer function. With the external resistor ROSC and capacitor COSC (see Fig.5) a self oscillating circuit is made, where ROSC and COSC determine the oscillating frequency. To realize an accurate 50% duty cycle, an internal divider is used. Due to the presence of the divider, the bridge frequency is half the oscillator frequency. The output voltage of the bridge will change at the falling edge of the signal on pin RC. The design equation for the half-bridge frequency is: 1 f osc = -------------------------------------------k x R OSC x C OSC An overview of the oscillator signal, internal LS and HS drive signals and the output is given in Fig.3.
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
UBA2024
handbook, halfpage
handbook, halfpage V
HV
VRC 0 time
HS drive 0 time
0 VDD VDD(start)
time
time LS drive 0 VOUT half bridge 0
MDB031
VSW VDD 0.8VRC(h)
time
0 fosc 2.5fnom
time
time
Fig.3 Oscillator, drivers and output signals.
fnom 0 Vlamp Vign minimum glow time control time
When entering the sweep mode, the oscillator starts at 2.5 times the nominal bridge frequency and sweeps down to the nominal bridge frequency fnom; see Fig.4. During this continuously decreasing of the frequency, the circuit approaches the resonance frequency of the load. This causes a high voltage across the load, which normally ignites the lamp. The sweep time tsweep is determined by the charge current Ich(sw) and the external capacitor CSW. The sweep to resonance time should be much larger than the settling time of the supply voltage on pin HV to guarantee that the full high-voltage is present at the moment of ignition. The amplitude of the RC oscillator is equal to the minimum value of VRC(h) and VSW + 0.4 x VRC(h). During the sweep time a current is flowing through the lamp electrodes for pre-heating the filaments.
Vglow Vnom 0 tsweep
MDB032
time
Fig.4 Start-up frequency behaviour.
Glow time control The drawback of cold-started CFL lamps is its inherent glow time which reduces the switching lifetime of the electrodes (lamp). To make this glow phase as short as possible, the maximum power is given to the lamp during the glow time via a special control; see Fig.4. Non-overlap time The non-overlap time is defined as the time that both MOSFETs are not conducting. The non-overlap time is internally fixed.
2004 Feb 03
4
Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
UBA2024
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to SGND; positive currents flow into the IC. SYMBOL VHV PARAMETER high-voltage supply voltage CONDITIONS normal operation mains transients during 0.5 s VFS VDD IDD VPGND Vi(RC) Vi(SW) SR Tj Tamb Tstg Vesd(HBM) floating supply voltage low-voltage output supply voltage low-voltage output supply current power ground voltage internal oscillator input voltage on pin RC sweep time input voltage on pin SW slew rate output on pin OUT junction temperature ambient temperature storage temperature HBM electrostatic discharge voltage on pins HV and VDD SW, RC, FS and OUT Vesd(MM) MM electrostatic discharge voltage on pins FS HV, VDD, SW, RC and OUT Notes 1. In accordance with the Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. 2. In accordance with the Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 1.5 k series resistor and a 0.75 H inductor. QUALITY SPECIFICATION Quality in accordance with SNW-FQ-611. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-c) Note 1. In accordance with IEC 60747-1. PARAMETER thermal resistance from junction to ambient thermal resistance from junction to case CONDITIONS in free air; note 1 note 1 TYP. 95 16 UNIT K/W K/W note 2 - - 200 250 V V note 1 - - 1000 2500 V V DC supply peak value is internally limited; Tamb = 25 C referenced to SGND Ii(RC) < 1 mA Ii(SW) < 1 mA repetitive - - VHV 0 0 -1 0 0 -4 -40 -40 -55 MIN. MAX. 373 550 VHV + 14 14 5 +1 VDD VDD +4 +150 +150 +150 V V V V mA V V V V/ns C C C UNIT
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
CHARACTERISTICS Tj = 25 C; all voltages are measured with respect to SGND; positive currents flow into the IC. SYMBOL High-voltage supply VHV VFS VDD high-voltage supply voltage floating supply voltage t < 0.5 s and IHV < 30 A t < 0.5 s and IFS < 30 A VHV = 100 V; ROSC = ; VSW = VDD; VRC = 0 V VHV = 100 V; ROSC = ; VSW = VDD; VRC = 0 V 0 0 - - 12.5 PARAMETER CONDITIONS MIN. TYP.
UBA2024
MAX.
UNIT
550 564
V V
Low-voltage supply low-voltage output supply voltage 11.7 13.3 V
Start-up state IHV VDD(start) VDD(stop) VDD(hys) RHS(on) RLS(on) VHS(d) VLS(d) IHS(sat) ILS(sat) Vboot tno VFS(lock) IFS fosc fosc(nom) fosc(nom) kh VRC(h) kl VRC(low) kosc high-voltage supply current start of oscillation voltage stop of oscillation voltage start-stop hysteresis voltage - 10 8 2 - - 1.4 1.2 900 900 0.7 1 3.6 VHV = 310 V; VFS = 12.2 V VSW = VDD 10 - - 11 8.5 2.5 0.39 12 9 3 mA V V V V V mA mA V s V A kHz kHz %
Output stage HS transistor on-resistance LS transistor on-resistance HS body diode forward voltage LS body diode forward voltage HS transistor saturation current LS transistor saturation current bootstrap diode drop voltage non overlap time floating supply lock-out voltage floating supply current VHV = 310 V; Id = 100 mA Id = 100 mA If = 200 mA If = 200 mA Vds = 30 V; Tj 125 C; VHV = 310 V Vds = 30 V; Tj 125 C If = 1 mA 9.7 8.5 1.8 1.6 - - 1.0 1.35 4.2 14 - 41.32 2 0.395 4.94 0.033 0.413 1.1 11 9.4 2.2 2.0 - - 1.3 1.7 4.8 18
Internal oscillator frequency range bridge oscillator nominal frequency bridge oscillator 60 42.68 - 0.408 5.29 0.036 0.458 1.135 V V ROSC = 100 k; COSC = 220 pF; 40.05 VSW = VDD
bridge oscillator frequency variation ROSC = 100 k; COSC = 220 pF; - with temperature T = -20 to +150 C high-level trip point factor high-level trip point voltage on pin RC low-level trip point factor low-level trip point voltage on pin RC oscillator constant VRC(l) = kl x VDD ROSC = 100 k; COSC = 220 pF VRC(h) = kh x VDD 0.382 4.58 0.030 0.367 1.065
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
UBA2024
SYMBOL Sweep function Ich(sw) tsweep
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
charge current for sweep sweep time
VSW = 0 V CSW = 33 nF; VDD = 12.2 V
215 0.28
280 0.35
345 0.45
nA s
APPLICATION INFORMATION
1.8 mH LFILT RFUS D1 D2 CBUF 4.7 uF D3 D4 CHB1 47 nF CHB2 47 nF
max. 550 V 11 W/150 mA
CFS 10 nF 3.1 mH CLA 1.5 nF LLA
HV FS
6 3
1 7
SW VDD
ROSC 110 K
AC mains supply (230 V)
33
OUT
CDV 100 pF
5 8
RC
COSC 180 pF
CVDD 10 nF
CSW 33 nF
UBA2024P
4 2 SGND
PGND
mdb033
Fig.5 Typical integrated CFL application with UBA2024P at f = 46 kHz.
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
UBA2024
SOT97-1
D
seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001 JEITA SC-504-8 EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-13
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively.
UBA2024
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP(2) Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. - suitable - suitable suitable(1) not suitable WAVE
2004 Feb 03
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Philips Semiconductors
Product specification
Half-bridge power IC for CFL lamps
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
UBA2024
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Feb 03
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R79/02/pp11
Date of release: 2004
Feb 03
Document order number:
9397 750 12676

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